The aim of the module is to provide the student with an overview of design and reliability methodologies used in electronic manufacturing. The introduction to the module deals with different aspects of circuit board design and development and technologies involved in this area. This leads on to how components are packaged, assembled, the chronological development of printed circuits board technologies and the use of automation in the electronic manufacturing and testing process. The second part of the module is dedicated to analytical aspects of reliability engineering providing a comprehensive description of important analytical methods that influence design, development, manufacture of engineering products and systems. A pragmatic approach is taken where possible covering maintenance strategies applicable in the electronic manufacturing process and process simulation from a reliability perspective.
The Electronic Manufacturing Process
Product design, Product development phases, Product life cycles, Interconnection hierarchy, Integrated circuit manufacture, Wafer fabrication, Component categories.
Circuit Board Manufacture
Insertion mounting devices, Surface mounting technology, Mass soldering methods, Evolution of integrated circuit packaging technology, Chip on board, Wire bonding, Tape automated bonding, Flip chip technology, Technology trends.
Reliability Engineering
Failure classification, Mechanical failure modes of electronic components, Cost of reliability, Rules of probability, Failure characteristics, Life history curve, Component replacement, Weibull analysis.
Censored Data and System Reliability
Weibull hazard plot, Shape parameter, Characteristic life, Mean life, Minimum life, System reliability, Series and parallel systems, Partially redundant systems, System Decomposition.
Conditional Probability
Conditional probability method, Cut set method, Fault tree analysis, Quantitative analysis, Expected negative utility.
System Lifetimes
Lifetime of parallel and series systems, Exponential component lifetimes, Standby systems, perfect switching, Constant hazard rates, Imperfect switching.
Part Failure Analysis
Mean time before failure, Operating condition factors, Methods of increasing reliability, Physical measure of reliability, Margin of safety, Monte Carlo simulation.
Markov Chain Analysis
Markov constraints, Practical applications, Markov limitations, The n transition matrix, Basis for element transition, Transition matrix with constant hazard rate, Systems subject to repair.
Clean Room Technology
Particle generation, Room classification, Clean area classification, Laminar flow, Non-laminar flow, Mixed flows, Isolators, Ventilated clean rooms, Containment rooms.
Simulation
Introduction to simulation, Stochastic and deterministic models, Model verification and validation, Simulation tradeoffs, Mean time to failure verification via simulation.
Sustainable Manufacturing.
Rationale for sustainable manufacturing; clean manufacturing technology; ecological manufacturing; energy-efficient manufacturing; remanufacturing; recycling of materials; environmentally conscious design and manufacturing processes; sustainable advanced manufacturing and manufacturability.
Lectures and a practical combination of labs and tutorials.
| Module Content & Assessment | |
|---|---|
| Assessment Breakdown | % |
| Formal Examination | 70 |
| Other Assessment(s) | 30 |