The aim of semiconductor fabrication is to introduce the student to the clean roomlaboratory where they will learn how to work safely and manufacture simple semiconductor devices.Furthermore the student will know and understand the challenges to beovercome during the fabrication process and will understand how to characterise theperformance of a device fabricated in the laboratory.
Introduction to semiconductor devices :
Intrinsic & extrinsic semiconductors, charge carriers, doping, capacitance.
Fabrication overview :
Silicon wafers, crystal growth, wafer preparation, lattice orientation, dielectric layers, semiconducting layers, basic structures, masks, fabrication processes for semiconductor devices.
Dielectric layers :
Thermal oxidation,factors affecting oxide growth rate, masking properties, oxide defects, impurity redistribution, oxidation systems, oxide thickness, evaluation methods, deposited oxides, oxideisolation.
Thin Film Deposition :
Vacuum basics, evaporation, DC & RF sputtering, magnetron sputtering.
Photolithography :
Masks, mask alignment, photoresists.
Semiconductor physics :
Investigation of MOS structure, energy band diagrams, contact potential.
| Module Content & Assessment | |
|---|---|
| Assessment Breakdown | % |
| Other Assessment(s) | 40 |
| Formal Examination | 50 |